Memory system package structure and manufacturing method thereof
AssigneeYangtze Memory Technologies Co., Ltd.
InventorsXinru ZENG, Zhen XU, Weisong QIAN, Peng CHEN
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Abstract
A memory system package structure and a manufacturing method thereof are disclosed. For example, the memory system package structure can include a memory chip, a memory controller and a distribution layer. The memory chip can include a first surface. The memory controller can be positioned on the first surface. The redistribution layer can be positioned on a side of the memory controller facing away from the memory chip. The memory chip and the memory controller can be electrically connected with the redistribution layer.
Claims16
A memory system package structure, comprising:
- a memory chip including a first surface;
- a memory controller positioned on the first surface;
- and
- a redistribution layer positioned on a side of the memory controller facing away from the memory chip, the memory chip and the memory controller being electrically connected with the redistribution layer.
A manufacturing method of a memory system package structure, comprising:
- providing a memory chip, the memory chip including a first surface and a second surface that are oppositely disposed, the second surface being stacked on a carrier;
- stacking a memory controller on the first surface;
- removing the carrier and exposing the second surface;
- and
- forming a redistribution layer on a side of the memory controller facing away from the memory chip, the memory chip and the memory controller being electrically connected with the redistribution layer.
Dependencies are inferred from the claim text.