Package, package structure and method of manufacturing package structure

A package structure, comprising:

• a first package, comprising:
• a die;
• a plurality of through vias surrounding the die;
• at least one dummy structure disposed between the die and the plurality of through vias and adjacent to at least one corner of the die;
• an encapsulant encapsulating the die, the plurality of through vias and the at least one dummy structure;
• and
• a redistribution structure disposed on the die, the plurality of through vias, the at least one dummy structure and the encapsulant and electrically connected to the die and the plurality of through vias;
• a plurality of joint terminals disposed on and electrically connected to the plurality of through vias;
• and
• a second package electrically connected to the first package through the plurality of joint terminals.

A method of manufacturing a package structure, comprising:

• forming a first package, comprising:
• forming a die, a plurality of through vias and at least one dummy structure on a carrier, wherein the plurality of through vias surround the die, the at least one dummy structure is disposed between the die and the plurality of through vias and adjacent to at least one corner of the die;
• encapsulating the die, the plurality of through vias and the at least one dummy structure by an encapsulant;
• forming a redistribution structure on the die, the plurality of through vias, the at least one dummy structure and the encapsulant;
• and
• separating the carrier from the first package;
• forming a plurality of joint terminals on the plurality of through vias;
• and
• stacking a second package on the first package, wherein the second package is electrically connected to the first package through the plurality of joint terminals.