Open cavity integrated circuit
OwnerSteven Alfred Kummerl, Sreenivasan K. Koduri +2inventors
InventorsSTEVEN ALFRED KUMMERL, SREENIVASAN K. KODURI, SOPHIA DELPAK, LAURA MAY ANTIONETTE CLEMENTE
Life of this patent
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Abstract
An electronic device includes a substrate and a die having an active surface disposed on the substrate. A sensor is in communication with the active surface of the die. A ring encircles the sensor and includes a cylindrical wall and a cap, where the cap has a partial circular shape that extends beyond each side of the wall. A mold compound covers the die and abuts an outer surface of the wall thereby forming a cavity in the mold compound to expose the sensor to an environment external to the electronic device.
Claims20
An electronic device comprising:
- a substrate;
- a die having an active surface, the die being disposed on the substrate;
- a sensor in communication with the active surface of the die;
- a ring encircling the sensor, the ring including a cylindrical wall and a cap, the cap having a partial circular shape that extends beyond each side of the wall;
- a mold compound covering the die and abutting an outer surface of the wall thereby forming a cavity in the mold compound to expose the sensor to an environment external to the electronic device.
A method comprising:
- providing a die including a sensor;
- depositing a ring on the die, the die encircling the sensor;
- placing the die on a substrate;
- placing the die and the substrate in a mold chase, the mold chase including film assist material;
- clamping the die with the mold chase, the film assist material contacting a cap of the ring;
- injecting a mold compound into the mold chase, the mold compound abutting an outer surface of the ring, the ring and the film assist material preventing the mold compound from entering an interior of the ring.
A method comprising:
- fabricating a die assembly comprising:
- providing a die having an active surface, the die including a sensor;
- depositing a stress relief layer on the active surface of the die;
- depositing a metal structure on the stress relief layer;
- depositing a photoresist material layer over the die, the photoresist material patterned to form a ring shaped opening on the metal structure;
- and
- electroplating metal on the metal structure in the ring shaped opening to form a metal ring;
- placing the die assembly on a substrate;
- placing the die assembly and the substrate in a mold chase, the mold chase including film assist material;
- clamping the die assembly and the substrate with the mold chase, the film assist material contacting a cap of the metal ring;
- and
- injecting a mold compound into the mold chase, the mold compound abutting an outer surface of the metal ring, the metal ring and the film assist material preventing the mold compound from entering an interior of the metal ring.
Dependencies are inferred from the claim text.