Integrated circuit packages including substrates with strengthened glass cores

A microelectronic assembly, comprising:

• a core made of glass and having a first surface and an opposing second surface, the core including:
• a first region having a first concentration of ions extending from the second surface of the core to a first depth;
• a second region having a second concentration of ions extending from the second surface of the core to a second depth, where the first region is between the second region and the second surface of the core;
• a through-glass via (TGV);
• and
• a material layer on the first and second surfaces of the core and along a lateral surface of the TGV;
• and
• a die at the second surface of the core and electrically coupled to the TGV by an interconnect.

A microelectronic assembly, comprising:

• a core made of glass and having a first surface and an opposing second surface, the core including:
• a first region having a first concentration of ions extending from the respective first and second surfaces of the core to a first depth;
• a second region having a second concentration of ions different than the first concentration of ions, the second region extending from the respective first and second surfaces of the core to a second depth;
• a third region having a third concentration of ions different than the first and second concentration of ions, the third region extending from the respective first and second surfaces of the core to a third depth, wherein the second region is between the third region and the respective first and second surfaces of the core;
• and
• a through-glass via (TGV);
• a dielectric with a conductive pathway at the second surface of the core, wherein the conductive pathway in the dielectric is electrically coupled to the TGV;
• and
• a die electrically coupled to the conductive pathway by an interconnect.