Semiconductor device
AssigneeSony Semiconductor Solutions Corporation
InventorsKeita TAKEUCHI, Satoshi YAMAMOTO
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Abstract
Provided is a semiconductor device including a stack including a semiconductor substrate, an opening provided extending from a first surface of the stack and filled with an insulating material, a pad electrode provided at a bottom of the opening, a wiring layer provided in a planar region of the stack overlapping a planar region where the opening is provided in plan view from the first surface, the wiring layer being electrically being connected to the pad electrode, and a through electrode provided in a planar region different from the planar region where the opening is provided in the plan view and provided extending from a second surface of the stack opposite to the first surface.
Claims15
A semiconductor device, comprising:
- a stack including a semiconductor substrate;
- an opening provided extending from a first surface of the stack and filled with an insulating material;
- a pad electrode provided at a bottom of the opening;
- a wiring layer provided in a planar region of the stack overlapping a planar region where the opening is provided in plan view from the first surface, the wiring layer being electrically connected to the pad electrode;
- and
- a through electrode provided in a planar region different from the planar region where the opening is provided in the plan view and provided extending from a second surface of the stack opposite to the first surface.
Dependencies are inferred from the claim text.