Manufacturing method, inspection method, and inspection device

2:

• The manufacturing method of the semiconductor device according to claim 1, further comprising:
• irradiating the semiconductor device with light and measuring light emission generated in the semiconductor device after the forming the first pad electrode.

3:

• The manufacturing method of the semiconductor device according to claim 2, further comprising:
• determining whether the light emitting element is a non-defective product or a defective product based on the identification result acquired by identifying a portion of the light emitting element with a contact failure based on a measurement result in the irradiating the second member and identifying a portion of the light emitting element with a leak failure based on a measurement result in irradiating the semiconductor device.

4:

• The manufacturing method of the semiconductor device according to claim 1, further comprising:
• identifying a position corresponding to each light emitting element of the semiconductor device in the reflected image based on a reflected image obtained by irradiating the second member with light and measuring reflected light from the second member and previously acquired design data of the semiconductor device.

6:

• The inspection method according to claim 5, further comprising:
• irradiating the measurement object with light and measuring light emission generated in the measurement object in a state in which the conductive layer is processed so that the electrical connection point of the N layer and the electrical connection point of the P layer are not electrically connected to each other.

7:

• The inspection method according to claim 6, further comprising:
• identifying a portion of the light emitting element with a contact failure based on a measurement result in irradiating the measurement object with light and measuring light emission generated in the measurement object in the state in which the conductive layer electrically connects the electrical connection point of the N layer and the electrical connection point of the P layer, identifying a portion of the light emitting element with a leak failure based on a measurement result in irradiating the measurement object with light and measuring light emission generated in the measurement object in the state in which the conductive layer is processed so that the electrical connection point of the N layer and the electrical connection point of the P layer are not electrically connected to each other, and determining whether the light emitting element is a non-defective product or a defective product based on the identification result.

8:

• The inspection method according to claim 5, further comprising:
• identifying a position corresponding to each light emitting element of the measurement object in the reflected image based on a reflected image obtained by irradiating the measurement object with light and measuring reflected light from the measurement object and previously acquired design data of the measurement object.

10:

• The inspection apparatus according to claim 9,
• wherein the processor outputs the measurement result of the optical measurement part in a state in which the conductive layer is processed so that the electrical connection point of the N layer and the electrical connection point of the P layer are not electrically connected to each other.

11:

• The inspection apparatus according to claim 10,
• wherein the processor identifies a portion of the light emitting element with a contact failure based on the measurement result of the optical measurement part in a state in which the electrical connection point of the N layer and the electrical connection point of the P layer are electrically connected to each other, identifies a portion of the light emitting element with a leak failure based on the measurement result of the optical measurement part in a state in which the electrical connection point of the N layer and the electrical connection point of the P layer are not electrically connected to each other, and determines whether the light emitting element is a non-defective product or a defective product based on the identification result.

12:

• The inspection apparatus according to claim 9,
• wherein the optical measurement part further measures reflected light from the measurement object in response to the light irradiated by the light irradiation part, and
• wherein the processor identifies a position corresponding to each light emitting element of the measurement object in a reflected image based on the reflected image obtained by measuring the reflected light in the optical measurement part and previously acquired design data of the measurement object.