Method for transferring a layer of a heterostructure

Abstract

A method of transferring a layer from a heterostructure to a receiver substrate comprises the following successive steps: supplying a donor substrate of a first material and a carrier substrate of a second material, bonding the donor substrate to the carrier substrate, thinning the donor substrate, so as to form the heterostructure comprising the thinned donor substrate on the carrier substrate, removing a peripheral portion of the donor substrate, forming a weakened region in the thinned donor substrate so as to delimit a layer of the first material to be transferred, bonding the heterostructure to a receiver substrate, the layer of the first material to be transferred being located at the bonding interface, and detaching the donor substrate along the weakened region so as to transfer the layer of the first material to the receiver substrate.

Dependencies are inferred from the claim text.