Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsYasushi TAKAKI, Kinya YAMASHITA, Masaki UENO
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Abstract
An apparatus for manufacturing semiconductor device includes a pickup apparatus. The pickup apparatus includes: a stage including a plurality of protruding portions disposed so as to face a back surface of a dicing sheet to which a semiconductor chip is attached; and a suction unit configured to vacuum-suck a space between an outer frame, the dicing sheet, and the stage. The plurality of protruding portions includes a plurality of first protruding portions and a plurality of second protruding portions different in height or vertical elastic modulus from each other.
Claims18
An apparatus for manufacturing a semiconductor device, the apparatus comprising:
- a stage including a plurality of protruding portions disposed so as to face a back surface of a dicing sheet to which a semiconductor chip is attached on a front surface;
- and
- a suction unit configured to vacuum-suck a space between the dicing sheet and the stage,
- wherein the plurality of protruding portions includes a plurality of first protruding portions and a plurality of second protruding portions different in height or vertical elastic modulus from each other.
Dependencies are inferred from the claim text.