Substrate processing apparatus and substrate processing method
AssigneeSamsung Electronics Co., Ltd.
InventorsSangjine Park, Jihwan Park, Kuntack Lee
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AssigneeSamsung Electronics Co., Ltd.
InventorsSangjine Park, Jihwan Park, Kuntack Lee
Estimating the term…
Provided is a substrate processing apparatus including a processing container having a processing space, a substrate support configured to support a substrate, a fluid supplier configured to supply a processing fluid in a supercritical state to the processing space, a shower head assembly configured to diffuse the processing fluid, a first laser portion configured to measure a horizontal alignment between the processing container and the shower head assembly, a second laser portion configured to measure a vertical alignment between the processing container and the shower head assembly, and a controller configured to correct the position of one of the substrate, the shower head assembly, and the processing container, based on the measured horizontal and vertical alignments, wherein the first and second laser portions are configured to be positioned within the processing container and to move above the substrate.
A substrate processing apparatus comprising:
A substrate processing apparatus comprising:
A substrate processing method comprising:
Dependencies are inferred from the claim text.