US 2024/0178022 A1 · CALCULATE WAFERS THICKNESS OUT OF WAFER MAPPING PROCESS

Abstract

A method of operating a substrate processing system that includes a substrate processing chamber, a substrate storage container and robot configured to select a substrate from the substrate storage container and transfer a selected substrate into the substrate processing chamber, the method comprising: detecting a lower edge and upper edge of the substrate; calculating a thickness of the substrate based on the detected lower and upper edges of the substrate; comparing the calculated thickness of the substrate to an expected thickness of the substrate; and (i) if the calculated thickness matches the expected thickness, controlling the robot to transfer the substrate into the substrate processing chamber, (ii) if the calculated thickness does not match the expected thickness, generating an alert indicating a thickness mismatch.

Claims20

Dependent claims

detecting a lower edge and upper edge of the substrate;
calculating a thickness of the substrate based on the detected lower and upper edges of the substrate;
comparing the calculated thickness of the substrate to an expected thickness of the substrate;
and
(i) if the calculated thickness matches the expected thickness, controlling the robot to transfer the substrate into the substrate processing chamber;
(ii) if the calculated thickness does not match the expected thickness, generating an alert indicating a thickness mismatch.

3 more elements

A substrate processing system comprising:

a substrate processing chamber;
a substrate storage container;
a robot configured to select a substrate from the substrate storage container and transfer the selected substrate into the substrate processing chamber;
and
a processor and a memory coupled to the processor, the memory including a 6 plurality of computer-readable instructions that, when executed by the processor, cause the system to:
detect a lower edge and upper edge of the substrate;
calculate a thickness of the substrate based on the detected lower and upper edges of the substrate;
compare the calculated thickness of the substrate to an expected thickness of the substrate, and:
(i) if the calculated thickness matches the expected thickness, controlling the robot to transfer the substrate into the substrate processing chamber, (ii) if the calculated thickness does not match the expected thickness, generating an alert indicating a thickness mismatch.

6 more elements

A non-transitory computer-readable memory that stores computer-readable instructions for operating a substrate processing system that includes a substrate processing chamber, a substrate storage container and robot configured to select a substrate from the substrate storage container and transfer the selected substrate into the substrate processing chamber, wherein, when executed by a processor operatively coupled to the substrate processing system, the computer-readable instructions cause the processor to control the substrate processing system to:

detect a lower edge and upper edge of the substrate;
calculate a thickness of the substrate based on the detected lower and upper edges 9 of the substrate;
compare the calculated thickness of the substrate to an expected thickness of the substrate, and (i) if the calculated thickness matches the expected thickness, controlling the robot to transfer the substrate into the substrate processing chamber, (ii) if the calculated thickness does not match the expected thickness, generating an alert indicating a thickness mismatch.

Dependencies are inferred from the claim text.

Calculate wafers thickness out of wafer mapping process

Life of this patent

Calculate wafers thickness out of wafer mapping process

Life of this patent

Abstract

Claims20