Equipment front-end modules for semiconductor processing systems and methods of making semiconductor processing systems

A method of making a semiconductor processing system, the method comprising:

• at an equipment front-end module including a frame assembly with a load port seat and a transfer robot seat, a fan filter unit supported by the frame assembly, a controls box enclosing the fan filter unit and supported by the fan filter unit, and a rear panel with a tunnel seat fixed to the frame assembly and separated from the load port seat by the transfer robot seat,
• removing a plate body with an inboard passthrough from the tunnel seat;
• fixing a tunnel body with an outboard passthrough at the tunnel seat and therethrough to the frame assembly by the rear panel;
• coupling a load lock module to the outboard passthrough defined by the tunnel body;
• coupling a substrate transfer module to the load lock module;
• and
• coupling a process module having a quad chamber arrangement to the substrate transfer module and therethrough to the equipment front-end module through the load lock module,
• whereby the process module with the quad chamber arrangement is spaced differently from the frame assembly along the transfer than a process module having a single or a dual chamber arrangement using a singular equipment front-end module arrangement.