Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien-Wei Wu, Hsien-Ju Tsou, Yung-Chi Lin, Tsang-Jiuh Wu
Estimating the term…
A manufacturing method of a semiconductor package includes the following steps. A semiconductor device is picked up from a carrier by a pick and place device, wherein the pick and place device includes a flexible head having a bonding portion configured to be in contact with the semiconductor device, a neck portion connecting the bonding portion, wherein a minimum width of the neck portion is substantially smaller than a maximum width of the bonding portion. The semiconductor device is placed and pressed onto a substrate by the pick and place device. An encapsulating material is formed over the substrate to laterally encapsulating the semiconductor device. A redistribution structure is formed over the semiconductor device and the encapsulating material. The substrate is removed.
A manufacturing method of a semiconductor package, comprising:
A pick and place device, comprising:
A workpiece handling apparatus, comprising:
Dependencies are inferred from the claim text.