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US 2024/0178013 A1Published application
Systems and methods for in-situ marangoni cleaning
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Chun HSU, Shu-Yen WANG, Chui-Ya PENG
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Abstract
In an embodiment, a method includes: immersing a wafer in a bath within a cleaning chamber, removing the wafer out of the bath through a solvent and into a gas within the cleaning chamber, determining a parameter value from the gas; and performing remediation within the cleaning chamber in response to determining that the parameter value is beyond a threshold value.
Claims20
A cleaning chamber, comprising:
- a tank region configured to accommodate a tank solution;
- a drying region configured to accommodate a gas;
- a solvent region configured to provide a solvent between the tank region and the drying region to separate the tank solution and the gas;
- a sensor configured to determine at least one parameter value associated with the gas within the drying region;
- and
- a control system configured to:
- move a wafer out of the tank solution and into the drying region;
- and
- perform at least one remediation within the cleaning chamber in response to a determination that the at least one parameter value exceeds at least one threshold value.
6 more elements
A cleaning chamber, comprising:
- a tank region configured to accommodate a tank solution;
- a drying region configured to accommodate a gas;
- a solvent region configured to provide a solvent between the tank region and the drying region to separate the tank solution and the gas;
- a sensor configured to determine a first parameter value and a second parameter value each associated with the gas within the drying region;
- and
- a control system configured to:
- move a wafer out of the tank solution and into the drying region;
- and
- perform a first remediation in response to determining that the first parameter value exceeds a first predetermined threshold value;
- and
- perform a second remediation in response to determining that the second parameter value exceeds a second predetermined threshold value, the second remediation being different than the first remediation.
8 more elements
A cleaning chamber, comprising:
- a tank region configured to accommodate a tank solution;
- a drying region configured to accommodate a gas;
- a solvent region configured to provide a solvent between the tank region and the drying region to separate the tank solution and the gas;
- a sensor configured to determine a first parameter value, a second parameter value and a third parameter value each associated with the gas within the drying region;
- and
- a control system configured to:
- move a wafer out of the tank solution and into the drying region;
- and
- perform a first remediation in response to determining that the first parameter value exceeds a first predetermined threshold value;
- and
- perform a second remediation in response to determining that the second parameter value exceeds a second predetermined threshold value, the second remediation being different than the first remediation;
- and
- perform a third remediation in response to determining that the third parameter value exceeds a third predetermined threshold value, the third predetermined threshold value being a different type than that of the first and second predetermined threshold values, and
- wherein the third remediation is different from the first and second remediations.
11 more elements
Dependencies are inferred from the claim text.