Back to results
US 2024/0178006 A1Published application
Leadless semiconductor package with wettable flanks and method for manufacturing the same
AssigneeSTMicroelectronics S.r.l.
InventorsIan Harvey ARELLANO, Aaron CADAG, Ela Mia CADAG
Life of this patent
Estimating the term…
Abstract
The present disclosure is directed to leadless semiconductor packages with improved wettable flanks that encourage the formation of solder fillets when the leadless semiconductor package is mounted to a substrate. The solder fillets are consistently formed and are easily detectable by inspection systems, such as automated optical inspection (AOI) systems.
Claims20
A method, comprising:
- forming a package, the forming of the package including:
- forming a die pad;
- positioning a die on the die pad;
- forming a plurality of conductive leads, each of the plurality of conductive leads includes a first portion extending in a first direction and a second portion extending in a second direction transverse to the first direction;
- forming encapsulation material on the die pad, the die, and the plurality of conductive leads,
- the encapsulation material including a first side, a second side opposite to the first side, and a plurality of third sides,
- the first portion of each of the plurality of conductive leads includes a first surface at the first side of the encapsulation material, and a second surface at one of the plurality of third sides of the encapsulation material,
- the second portion of each of the plurality of conductive leads includes a third surface at the second side of the encapsulation material;
- positioning the package on an adhesive layer such that the second side of the encapsulation material faces the adhesive layer;
- and
- forming a conductive layer on the first and second surfaces of the first portion of each of the plurality of conductive leads.
8 more elements
A method, comprising:
- positioning a die on a die pad;
- forming a plurality of conductive leads, each of the plurality of conductive leads includes a first portion extending in a first direction and a second portion extending in a second direction transverse to the first direction, the first portion having a first surface and a side surface, the second portion having a first surface, the first surface of the first portion and the first surface of the second portion facing in opposite directions;
- forming encapsulation material on the die and the plurality of conductive leads;
- forming an adhesive layer on the encapsulation material and the first surface of the second portion of each of the plurality of conductive leads;
- and
- forming a conductive layer on the first surface and the side surface of the first portion of each of the plurality of conductive leads.
3 more elements
A method, comprising:
- positioning a die on a die pad;
- forming a plurality of conductive leads, each of the plurality of conductive leads includes a first surface, a second surface opposite to the first surface, and a side surface;
- forming encapsulation material on the die and the plurality of conductive leads;
- forming an adhesive layer on the encapsulation material and the second surface of each of the plurality of conductive leads;
- and
- forming a conductive layer on the first surface and the side surface of each of the plurality of conductive leads.
3 more elements
Dependencies are inferred from the claim text.