US 2024/0177992 A1 · METHOD OF FORMING AN ORGANIC POLYMER COMPRISING POLYIMIDE

Abstract

The disclosure relates to methods of forming organic polymers comprising polyimide and layers comprising the same and to methods of reducing polyamic acid content of an organic polymer. The embodiments of the disclosure further relate to methods of fabricating semiconductor devices, to selectively depositing a material on a surface of a semiconductor substrate and to semiconductor processing assemblies. The methods are characterized by contacting a polyimide-containing material, such as a layer, with a modifying agent that increases the proportion of polyimide in the organic polymer material.

Claims20

Dependent claims

A method of forming a modified organic polymer comprising polyimide, the method comprising:

providing a substrate in a reaction chamber;
providing a first polymer precursor into the reaction chamber in a vapor phase;
and
providing a second polymer precursor into the reaction chamber in a vapor phase to deposit an organic polymer comprising polyimide on the substrate;
wherein the first polymer precursor comprises a molecule having at least two acid anhydride groups and the second polymer precursor comprises a molecule comprising at least two amine groups, and
wherein the method further comprises providing a modifying agent into the reaction chamber in a vapor phase to increase the proportion of polyimide in the organic polymer on the substrate to form the modified organic polymer comprising polyimide.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/519,172Filed 27 Nov 2023

Priority

30 Nov 2022

Published

30 May 2024

Term ends

Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10P 14/6529
Of treatments performed after formation of the materials: by exposure to a gas or vapour
H10P 14/6339
Using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition: deposition by cyclic CVD, e.g. ALD, ALE or…
H10P 14/668
Characterised by the type of materials: the materials being characterised by the deposition precursor materials
H10P 14/683
Organic materials, e.g. photoresists: carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC

Method of forming an organic polymer comprising polyimide

Life of this patent

Method of forming an organic polymer comprising polyimide

Life of this patent

Abstract

Claims20