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US 2024/0177974 A1Published application
Wafer support
AssigneeFerrotec Material Technologies Corporation
InventorsWataru YAMAGISHI, Kazumasa MORI, Hitoshi KOUNO, Shunichi ETO
Life of this patent
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Abstract
A wafer support includes a base material including a machinable ceramic, a protective layer covering a surface of the base material, and conductive members and placed at least partially inside the base material. The protective layer includes a material that is less corrodible by plasma than the base material.
Claims8
A wafer support comprising:
- a base material including a machinable ceramic;
- a protective layer covering a surface of the base material;
- and a conductive member placed at least partially inside the base material,
- the protective layer including a material that is less corrodible by plasma than the base material.
1 more element
Dependencies are inferred from the claim text.