Glass embedded true air core inductors

A method of forming an air core inductor in a substrate, comprising:

• forming a first series of holes through the substrate;
• forming a seed layer along surfaces of the substrate;
• masking portions of the substrate between selected ones of the first series of holes with a mask;
• plating a first structure and a second structure over exposed portions of the seed layer, wherein the first structure and the second structure fill the first series of holes;
• removing the mask;
• and
• etching through the substrate to form a second series of holes between the first structure and the second structure.

A package substrate, comprising:

• a core, wherein the core comprises glass;
• buildup layers above and below the core;
• and
• an air core inductor embedded in the core, wherein the air core inductor comprises a first conductive structure and a second conductive structure that are separated from each other by an air gap.

An electronic system, comprising:

• a board;
• a package substrate coupled to the board, wherein the package substrate comprises:
• an air core inductor embedded in a core of the package substrate;
• and
• a die coupled to the package substrate.