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US 2024/0176977 A1Published application
Chip card, and process for manufacturing a chip card
AssigneeGiesecke+Devrient Epayments GmbH
InventorAndreas MINKS
Life of this patent
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Abstract
A chip card has a flexible inlay including chip card contacts on an upper face of the inlay and which supports an integrated circuit and an antenna, both of which are spaced apart from the contacts. The chip card further includes a top layer with a recess in which the contacts are placed, and a metal layer which is located below the inlay and includes a slit that extends from a peripheral surface of the metal layer to the area of the recess and extends through the entire thickness of the metal layer.
Claims11
-10. (canceled)
A chip card, including:
- a flexible inlay having contacts of the chip card arranged on an upper side of the inlay,
- wherein the inlay carries an integrated circuit and antenna spaced apart from the contacts,
- an upper layer having a recess, in which the contacts are arranged, and
- a metal layer arranged below the inlay, having a slot, which extends from a circumferential surface of the metal layer into the area of the recess, and which extends through the entire thickness of the metal layer.
1 more element
A process for manufacturing a chip card, having the following steps:
- providing a flexible inlay having contacts of the chip card arranged on an upper side of the inlay,
- wherein the inlay carries an integrated circuit and antenna spaced apart from the contacts,
- arranging an upper layer having a recess on the upper side of the inlay in such a way that the contacts are arranged in the recess,
- arranging a metal layer having a slot below the inlay, which extends from a circumferential surface of the metal layer into the area of the recess and extends through the entire thickness of the metal layer, and
- laminating the layers to form a chip card.
2 more elements
Dependencies are inferred from the claim text.