Method Of Using An RFID Label On A High-Temperature Product
AssigneePrint Management Partners, Inc.
InventorDan Schroer
Life of this patent
Estimating the term…
Abstract
A method of using a high-temperature RFID label includes providing a label. The label includes a pressure-sensitive polymeric material, a liner, and an adhesive located between the pressure-sensitive polymeric material and the liner. An RFID tag is provided. The RFID tag includes an RFID chip or integrated circuit and an antenna. The RFID tag is located at least partially inside of the label to form the high-temperature RFID label. A portion of the liner is removed from the high-temperature RFID label. The high temperature RFID label is attached on a product. The product exceeds a temperature of at least about 300° F. The high-temperature RFID label is located outside of a periphery of the product. The RFID label may further include a printable top layer.
Claims21
1-20. (canceled)
A method of using a high-temperature radio frequency identification (RFID) label, the method comprising:
- providing a label, the label including a pressure-sensitive polymeric material, a liner, and an adhesive located between the pressure-sensitive polymeric material and the liner;
- providing an RFID tag, the RFID tag including an RFID chip or integrated circuit and an antenna, the RFID tag being located at least partially inside of the label to form the high-temperature RFID label;
- removing a portion of the liner from the high-temperature RFID label;
- and
- attaching the high temperature RFID label on a product during the manufacturing of the product, the product exceeding a temperature of at least 400° F. during the attaching, the high-temperature RFID label being located outside of a periphery of the product.
A method of using a high-temperature radio frequency identification (RFID) label, the method comprising:
- providing a label, the label including a pressure-sensitive polymeric material, a liner, an adhesive, and a printable top layer, the adhesive located between the pressure-sensitive polymeric material and the liner, the pressure-sensitive polymeric material being located between the printable top layer and the adhesive;
- providing an RFID tag, the RFID tag including an RFID chip or integrated circuit and an antenna, the RFID tag being located at least partially inside of the label to form the high-temperature RFID label;
- removing a portion of the liner from the high-temperature RFID label;
- and
- attaching the high temperature RFID label on a product during the manufacturing of the product, the product exceeding a temperature of at least 400° F. during the attaching, the high-temperature RFID label being located outside of a periphery of the product.
Dependencies are inferred from the claim text.