Photonic integrated circuit packages including substrates with glass cores

A photonic assembly, comprising:

• a substrate, including:
• a core having a surface, wherein a material of the core includes glass;
• dielectric with conductive traces on a portion of the surface of the core;
• a photonic integrated circuit (PIC) and an integrated circuit (IC) electrically coupled to the conductive traces in the dielectric at the surface of the core;
• a first optical component, along a perimeter of the core, between to the PIC and the surface of the core, wherein the first optical component includes a first surface coupled to the surface of the core and an opposing second surface coupled to the PIC by optical glue or by fusion bonding;
• and
• a second optical component coupled to the first optical component and optically coupled to the PIC by an optical pathway through the first optical component.

A photonic assembly, comprising:

• a substrate, including:
• a core having a surface, wherein a material of the core includes glass;
• and
• a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways;
• a plurality of photonic integrated circuits (PICs) electrically coupled to the conductive pathways in the dielectric material;
• a first optical component made of glass, along a perimeter of the core, between the plurality of PICs and the surface of the core, wherein the first optical component is coupled to the surface of the core;
• and
• a plurality of second optical components coupled to the first optical component, wherein the plurality of second optical components are optically coupled to the plurality of PICs by optical pathways through the first optical component.