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US 2024/0176084 A1Published application
Photonic integrated circuit (pic) first patch architecture
AssigneeIntel Corporation
InventorsJeremy D. Ecton, Srinivas V. Pietambaram, Brandon Christian Marin, Gang Duan, Bai Nie
Life of this patent
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Abstract
A PIC first patch architecture includes a solderless electrical connection at a die interconnect surface. Redistribution layers (RDLs) are patterned onto a face of an integrated circuit (IC) die and photonic integrated circuit (PIC) die prior to placement of the RDLs into a cavity in a glass layer. Optical interconnections for the PIC die are protected during RDL patterning and optical waveguides may be patterned into the glass layer fore or after assembling the PIC first patch including the RDL and glass layer.
Claims20
An apparatus, comprising:
- mold structure comprising a face having a first portion with electrical contacts for an integrated circuit (IC) die and a photonic integrated circuit (PIC) die, and a second portion comprising optical interconnects;
- a substrate layer comprising one or more redistribution layers (RDLs) patterned on the electrical contacts on the first portion;
- a glass layer having an upper surface and a lower surface, the upper surface including a cavity, the cavity having therein a plurality of through-glass vias (TGVs) extending substantially perpendicularly to the lower surface;
- and
- the mold structure attached to the glass layer such that the substrate layer is located in the cavity and the second portion of the mold structure is flush with the upper surface of the glass layer.
2 more elements
A method, comprising:
- fabricating a mold structure comprising a face having a first portion with electrical contacts for an integrated circuit (IC) die and a photonic integrated circuit (PIC) die, and a second portion comprising optical interconnects for the PIC;
- locating a thermal decomposable polymer layer on the second portion;
- locating a metal etch stop over the second portion;
- patterning one or more redistribution layers (RDLs) on the electrical contacts on the first portion;
- overlaying the one or more RDLs with a bond film;
- and
- removing the bond film and etch stop over the second portion.
4 more elements
Dependencies are inferred from the claim text.