Photonic integrated circuit packages including substrates with glass cores

A photonic assembly, comprising:

• a substrate, including:
• a core having a surface, wherein a material of the core includes glass and the core includes a first optical component;
• and
• a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways and an interconnect die;
• a photonic integrated circuit (PIC) having an active surface facing towards the surface of the core, wherein the PIC is electrically coupled to the interconnect die and to the conductive pathways in the dielectric material at the surface of the core;
• a processor integrated circuit (XPU) electrically coupled to the interconnect die and to the conductive pathways in the dielectric material at the surface of the core;
• a second optical component optically coupled to the active surface of the PIC and to the first optical component in the core;
• and
• a third optical component coupled to the first optical component in the core, wherein the third optical component is optically coupled to the PIC by an optical pathway through the first and second optical components.

A photonic assembly, comprising:

• a substrate, including:
• a core having a surface, wherein a material of the core includes glass;
• and
• a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways and an interconnect die;
• a photonic integrated circuit (PIC) having an active surface facing towards the surface of the core, wherein the PIC is electrically coupled to the interconnect die and to the conductive pathways in the dielectric material at the surface of the core;
• an integrated circuit (IC) electrically coupled to the interconnect die and to the conductive pathways in the dielectric material at the surface of the core;
• a first optical component optically coupled to the active surface of the PIC and to the surface of the core, wherein at least a portion of the first optical component is between the active surface of the PIC and the surface of the core;
• and
• a fiber connector coupled to the core, wherein the fiber connector is optically coupled to the PIC by an optical pathway through the first optical component and the core.