US 2024/0175772 A1 · ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Abstract

In one example, an electronic device includes a substrate structure and a housing. The housing is coupled to the substrate structure and includes a first chamber, a second chamber isolated from the first chamber, a first port comprising a first passage coupled to the first chamber, and a second port comprising a second passage coupled to the second chamber. An electronic component within the first chamber and includes a top side and a lower side opposite to the top side and isolated from the top side. The top side of the electronic component is configured to receive a first stimulus through the first passage and the first chamber, and the lower side of the electronic component is configured to receive a second stimulus through the second passage and the second chamber. Other examples and related methods are also disclosed herein.

Claims20

Dependent claims

An electronic device, comprising:

a substrate structure;
a housing coupled to the substrate structure comprising:
a housing top;
housing walls;
a first port extending outward from the housing top;
and
a second port extending outward from the housing top;
wherein:
the substrate structure, the housing top, and the housing walls define a first chamber and a second chamber isolated from the first chamber;
the first port is fluidly coupled to the first chamber;
and
the second port is fluidly coupled to the second chamber;
and
a first electronic component within the first chamber and comprising:
a top side;
and
a lower side opposite to the top side and isolated from the top side;
wherein:
the top side is in fluid communication with the first chamber and the first port and is configured to receive a first stimulus;
and
the lower side is in fluid communication with the second chamber and the second port and is configured to receive a second stimulus.

18 more elements

A method of manufacturing an electronic device, comprising:

providing a substrate structure;
providing a housing comprising:
a first chamber;
a second chamber isolated from the first chamber;
a first port comprising a first passage coupled to the first chamber;
and
a second port comprising a second passage coupled to the second chamber;
providing a first electronic component comprising:
a top side;
and
a lower side opposite to the top side;
and
coupling the first electronic component to one of the substrate structure or the housing within the first chamber;
wherein:
top side of the first electronic component is isolated from the lower side of the first electronic component;
the top side of the first electronic component is configured to receive a first stimulus within the first chamber;
and
the lower side of the first electronic component is configured to receive a second stimulus within the second chamber.

15 more elements

Dependencies are inferred from the claim text.

Electronic devices and methods of manufacturing electronic devices

Life of this patent

Electronic devices and methods of manufacturing electronic devices

Life of this patent

Abstract

Claims20