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US 2024/0175764 A1Published application
Temperature sensor
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsNorimichi NOGUCHI, Daisuke SUETSUGU, Yuki OHYAMA, Kazuhiro KANDA, Yuji YASUOKA
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Abstract
A temperature sensor according to the present disclosure includes an alumina substrate, a planarization film, a first resistive portion, and at least one second resistive portion. The planarization film contains alumina as a main component thereof and is formed on the alumina substrate. The first resistive portion is formed on the planarization film. The at least one second resistive portion is formed on the planarization film and forms a bridge circuit along with the first resistive portion.
Claims9
A temperature sensor comprising:
- an alumina substrate;
- a planarization film containing alumina as a main component thereof and formed on the alumina substrate;
- a first resistive portion formed on the planarization film;
- and
- at least one second resistive portion formed on the planarization film and forming a bridge circuit along with the first resistive portion.
2 more elements
Dependencies are inferred from the claim text.