Micro-bolometer and thermal sensing method thereof
AssigneeSONIX Technology Co., Ltd.
InventorsChien-Liang Lin, Chen-Liang Li
Life of this patent
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Abstract
A micro-bolometer and a thermal sensing method thereof are provided. Each of switching circuits switches connection relationship between a first connection point or a second connection point of a corresponding thermal sensing pixel and different signal transmission lines and a shared connection line, so as to adjust the connection mode of the thermal sensing pixels, the first signal transmission line, the second signal transmission line and the at least one shared connection line, and thus to change a sensing signal provided by the thermal sensing pixels.
Claims11
A micro-bolometer, comprising:
- a plurality of thermal sensing pixels, wherein each of the thermal sensing pixels has a first connection point and a second connection point;
- and
- a plurality of switching circuits, respectively coupled to a first signal transmission line, a second signal transmission line, at least one shared connection line, and the first connection point or the second connection point of the corresponding thermal sensing pixel, switching connection relationship between the first connection point or the second connection point of the corresponding thermal sensing pixel and the first signal transmission line, the second signal transmission line and the at least one shared connection line, so as to adjust a connection mode of the thermal sensing pixels, the first signal transmission line, the second signal transmission line and the at least one shared connection line to change a sensing signal provided by the thermal sensing pixels, wherein the thermal sensing pixels and the switching circuits are jointly formed on a silicon substrate through a semiconductor manufacturing process.
A thermal sensing method of a micro-bolometer, wherein the micro-bolometer comprises a plurality of thermal sensing pixels and a plurality of switching circuits, and each of the thermal sensing pixels has a first connection point and a second connection point, the thermal sensing method of the micro-bolometer comprising:
- providing the switching circuits, wherein the switching circuits are connected to a first signal transmission line, a second signal transmission line, at least one shared connection line, and the first connection point or the second connection point of the corresponding thermal sensing pixel;
- and
- controlling the switching circuits to switch connection relationship between the first connection point or the second connection point of the corresponding thermal sensing pixel and the first signal transmission line, the second signal transmission line and the at least one shared connection line, so as to adjust a connection mode of the thermal sensing pixels, the first signal transmission line, the second signal transmission line and the at least one shared connection line to change a sensing signal provided by the thermal sensing pixels, wherein the thermal sensing pixels and the switching circuits are jointly formed on a silicon substrate through a semiconductor manufacturing process.
Dependencies are inferred from the claim text.