Microelectromechanical device with test structure, test equipment for testing microelectromechanical devices and method for manufacturing a microelectromechanical device

A method for manufacturing a microelectromechanical device, comprising:

• forming a support body;
• forming at least one movable mass of semiconductor material, elastically constrained to the support body to oscillate along one or more axes;
• forming fixed detection electrodes rigidly connected to the support body and capacitively coupled to the at least one movable mass;
• forming at least one test structure of semiconductor material rigidly connected to the support body, capacitively coupled to the at least one movable mass, and distinct from the fixed detection electrodes;
• and
• applying, with the at least one test structure, electrostatic forces to the at least one movable mass in response to a voltage between the at least one test structure and the at least one movable mass.

A method, comprising:

• coupling a test machine of test equipment to contact pads of a first microelectromechanical device, the first microelectromechanical device including:
• a movable mass of semiconductor material elastically constrained to a support body to oscillate along one or more axes;
• fixed detection electrodes rigidly connected to the support body and capacitively coupled to the movable mass;
• and
• a test structure of semiconductor material rigidly connected to the support body, capacitively coupled to the movable mass, distinct from the fixed detection electrodes, and configured to apply electrostatic forces to the movable mass in response to a voltage between the test structure and the movable mass, wherein the movable mass and the test structure are each electrically to a respective one of the contact pads;
• and
• testing the first microelectron mechanical device by applying, with a test signal generator of the test machine, a test voltage between the movable mass and the test structure via the contact pads.