Vapor compression refrigeration cycle device
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTsuneko IMAGAWA, Yuki YAMAOKA, Yasuaki BANDO
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AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTsuneko IMAGAWA, Yuki YAMAOKA, Yasuaki BANDO
Estimating the term…
[Object] It is an object of the present invention to provide a vapor compression refrigeration cycle device capable of obtaining necessary heating ability when an injection amount becomes small. [Solving Means] A vapor compression refrigeration cycle device of the invention includes: a main refrigerant circuit 10 formed by sequentially connecting a compressor 11, a use-side heat exchanger 12, an intermediate heat exchanger 13, a first expansion device 14 and a heat source-side heat exchanger 15 to one another through a refrigerant pipe 16; a bypass refrigerant circuit 20 which branches off from the refrigerant pipe 16 located between the use-side heat exchanger 12 and the first expansion device 14, and which is formed by sequentially connecting a second expansion device 21, the intermediate heat exchanger 13 and a compression midstream of the compressor 11; and a control device 50 for controlling valve opening degrees of the first expansion device 14 and the second expansion device 21; wherein when a pressure ratio of discharge pressure of refrigerant discharged from the compressor 11 and suction pressure of refrigerant sucked into the compressor 11 is equal to or smaller than a reference pressure ratio, the control device 50 controls the compressor 11 such that number of rotations of the compressor 11 is increased.
A vapor compression refrigeration cycle device comprising:
A vapor compression refrigeration cycle device comprising:
A vapor compression refrigeration cycle device comprising:
Dependencies are inferred from the claim text.