Systems and methods for controlling pressure in substrate processing systems

A method of controlling pressure for a gate valve opening event in a substrate processing system that includes a substrate handling chamber that transfers substrates into and out of a reaction chamber through a gate valve, the method comprising:

• with a reaction chamber pressure control valve for the reaction chamber fixed at a first position, thereby holding the reaction chamber at a reaction chamber pressure:
• (a) receiving input indicating the reaction chamber pressure;
• (b) receiving input indicating substrate handling chamber pressure;
• (c) determining whether the reaction chamber pressure and the substrate handling chamber pressure are within a gate valve opening pressure range, wherein the reaction chamber pressure and the substrate handling chamber pressure are within the gate valve opening pressure range when the substrate handling chamber pressure is greater than or equal to the reaction chamber pressure but no more than the reaction chamber pressure plus a first predetermined amount;
• and
• (d) controlling a substrate handling chamber pressure control valve to adjust the substrate handling chamber pressure until the reaction chamber pressure and the substrate handling chamber pressure are within the gate valve opening pressure range.

A substrate processing system, comprising:

• a reaction chamber;
• a reaction chamber pressure sensor configured to measure reaction chamber pressure;
• a reaction chamber pressure control valve;
• a substrate handling chamber;
• a substrate handling chamber pressure sensor configured to measure substrate handling chamber pressure;
• a substrate handling chamber pressure control valve, wherein the substrate handling chamber pressure control valve is electronically controllable;
• a gate valve between the reaction chamber and the substrate handling chamber, the gate valve switchable between an open configuration in which the reaction chamber and the substrate handling chamber are open to one another and a closed configuration in which the substrate handling chamber and the reaction chamber are sealed off from one another;
• an input system configured to receive:
• (i) input data from the reaction chamber pressure sensor indicating the reaction chamber pressure, and (ii) input data from the substrate handling chamber pressure sensor indicating the substrate handling chamber pressure;
• and
• a control system configured to send signals to adjust the substrate handling chamber pressure control valve in response to the input data from the reaction chamber pressure sensor and the input data from the substrate handling chamber pressure sensor and place the substrate handling chamber pressure within a gate valve opening pressure range, wherein the substrate handling chamber pressure is within the gate valve opening pressure range when the substrate handling chamber pressure is greater than or equal to the reaction chamber pressure but no more than the reaction chamber pressure plus a first predetermined amount.