Curable polyolefin composition and cured product
AssigneesDow Global Technologies LLC, Dow Silicones Corporation
InventorsChao HE, Dorab BHAGWAGAR, Ling LING, Hongyu CHEN, Chen CHEN, Jiguang ZHANG
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Abstract
A curable polyolefin composition is provided. The curable polyolefin composition comprises: (A) a polyolefin having at least two aliphatic unsaturated bonds per molecule and having a viscosity at 25° C. of less than 2,500 mPa·s; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; and (D) a thermal conductive filler. The curable polyolefin composition can be cured to form a soft material with good thermal conductive properties.
Claims8
A curable polyolefin composition comprising:
- (A) a polyolefin having at least two aliphatic unsaturated bonds per molecule and having a viscosity at 25° C. of less than 2,500 mPa·s;
- (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, in an amount such that a cured product obtained by curing the composition has a Shore OO hardness of less than 80;
- (C) a hydrosilylation reaction catalyst, in an amount such that a catalytic metal in this component relative to the composition is not less than 2 ppm in terms of mass unit;
- and
- (D) a thermal conductive filler.
Dependencies are inferred from the claim text.