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US 2024/0174892 A1Published application
Polishing compositions and methods of use thereof
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsTing-Kai Huang, Yannan Liang, Bin Hu, Chun-Fu Chen, Ying-Shen Chuang, Tzu-Wei Chiu, Sung TsaiLin, Hanyu Fan, Hsin-Hsien Lu
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Abstract
This disclosure relates to a polishing composition that includes an abrasive, at least two pH adjusters, a barrier film removal rate enhancer, a low-k removal rate inhibitor, and an azole-containing corrosion inhibitor. This disclosure also features a method of using the polishing composition to polish a substrate containing copper and silicon oxide.
Claims24
A polishing composition, comprising:
- an abrasive;
- at least two pH adjusters comprising at least one inorganic base and at least one organic base, wherein the molar ratio of the at least one organic base to the at least one inorganic base is from about 0.05 to about 2;
- a barrier film removal rate enhancer;
- a low-k removal rate inhibitor;
- and
- an azole-containing corrosion inhibitor.
3 more elements
Dependencies are inferred from the claim text.