Titanium dioxide chemical-mechanical polishing composition for polishing nickel substrates
AssigneeEntegris, Inc.
InventorsCheng-Yuan KO, Jin-Hao JHANG
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Abstract
The invention provides a chemical-mechanical polishing composition comprising: (a) a rutile titanium dioxide abrasive; (b) an organic polishing promoter comprising a carboxylic acid, a urea, an amine, a thiol, a hydroxyl, an amide, a sulfonic acid, salts thereof, or combinations thereof; and (c) water, wherein the chemical-mechanical polishing composition has a pH of about 5 to about 12. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising a nickel layer on a surface of the substrate, using a chemical-mechanical polishing composition comprising a rutile titanium dioxide abrasive.
Claims20
A chemical-mechanical polishing composition comprising:
- (a) a rutile titanium dioxide abrasive;
- (b) an organic polishing promoter comprising a carboxylic acid, a urea, an amine, a thiol, a hydroxyl, an amide, a sulfonic acid, salts thereof, or combinations thereof;
- and
- (c) water,
- wherein the chemical-mechanical polishing composition has a pH of about 5 to about 12.
A method of chemically-mechanically polishing a substrate comprising:
- (i) providing a substrate comprising nickel on a surface of the substrate,
- (ii) providing a polishing pad,
- (iii) providing a chemical-mechanical polishing composition comprising a rutile titanium dioxide abrasive,
- (iv) contacting the substrate with the polishing pad and the chemical-mechanical polishing composition, and
- (v) moving the polishing pad and the chemical-mechanical polishing composition relative to the substrate, wherein at least a portion of the nickel on a surface of the substrate is abraded at a nickel removal rate to polish the substrate.
Dependencies are inferred from the claim text.