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US 2024/0174890 A1Published application
Cmp slurry composition for polishing tungsten and method of polishing tungsten using the same
AssigneeSamsung SDI Co., Ltd.
InventorsKeun Sam JANG, Won Jung KIM, Tae Won PARK, Ji Ho LEE, Eui Rang LEE, Jin Gyo KIM, Dong Hyeon LEE, Chang Suk LEE
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Abstract
A CMP slurry composition for polishing tungsten and a method of polishing tungsten using the same, the composition includes a polar solvent or a nonpolar solvent; an abrasive agent; and a compound represented by Formula 3 or a complex thereof:
Claims20
A CMP slurry composition for polishing tungsten, the composition comprising:
- a polar solvent or a nonpolar solvent;
- an abrasive agent;
- and
- a compound represented by Formula 3 or a complex thereof:
- wherein, in Formula 3,
- R1, R2, and R3 are each independently a single bond or a substituted or unsubstituted C1 to C3 alkylene group,
- R4, R5, and R6 are each independently a substituted or unsubstituted C1 to C3 alkylene group, and
- M1, M2, and M3 are each independently OH or O−M+, M+ being a monovalent cation.
5 more elements
Dependencies are inferred from the claim text.