Back to results
US 2024/0174849 A1Published application
Resin composition
AssigneeNan Ya Plastics Corporation
InventorsTe-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu
Life of this patent
Estimating the term…
Abstract
A resin composition is provided, which includes a novel low-dielectric resin, a cross-linking agent, a polyphenylene ether resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low-dielectric resin has a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%, which may effectively reduce the dissipation factor of the resin composition, and achieve the electrical specification of low dielectric.
Claims10
A resin composition, comprising:
- a novel low-dielectric resin, having a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%;
- a cross-linking agent;
- a polyphenylene ether resin;
- a halogen-free flame retardant;
- a spherical silica;
- and
- a siloxane coupling agent.
4 more elements
Dependencies are inferred from the claim text.