Resin composition, resin sheet, multilayered printed wiring board, and semiconductor device

A resin composition comprising:

• a bismaleimide compound (A) including a constituent unit represented by the following Formula (1) and maleimide groups at both ends of a molecular chain;
• a compound (B) containing one or more carboxy groups;
• and
• a photocuring initiator (C):
• in Formula (1), R1 indicates a linear or branched C1-C16 alkylene group or a linear or branched C2-C16 alkenylene group, R2 indicates a linear or branched C1-C16 alkylene group or a linear or branched C2-C16 alkenylene group, R3 each independently represents a hydrogen atom, a linear or branched C1-C16 alkyl group, or a linear or branched C2-C16 alkenyl group, R4 each independently represents a hydrogen atom, a linear or branched C1-C6 alkyl group, a halogen atom, a hydroxy group or a linear or branched C1-C6 alkoxy group, n1 each independently represents an integer of 1 to 4, and n2 each independently represents an integer of 1 to 4.