Glass material
AssigneeCdgm Glass Co., Ltd
InventorsLulu MAO, Bo KUANG, Liangzhen HAO
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Abstract
The present invention provides a glass material that has a suitable thermal expansion coefficient to meet the application in the field of semiconductor manufacturing. A glass material, wherein components thereof are represented by weight percentage, comprising: 43-63% of SiO2; 0-15% of B2O3; 2-15% of Al2O3; 11-30% of BaO; 3-18% of CaO. Through rational component design, the glass material of the present invention has a suitable thermal expansion coefficient and is applicable to the field of semiconductor manufacturing.
Claims14
A glass material, wherein components thereof are represented by weight percentage, comprising:
- 43-63% of SiO2;
- 0-15% of B2O3;
- 2-15% of Al2O3;
- 11-30% of BaO;
- 3-18% of CaO.
Dependencies are inferred from the claim text.