Methods of separating a substrate

Abstract

The disclosure relates to a method of laser processing a glass material, including: applying a layer of water to a top surface of a substrate support surface; positioning the glass material onto the substrate support surface, wherein the glass material comprises: a first surface, a second surface opposing the first surface, a plurality of perforations formed within the glass material along a cutting line, wherein the plurality of perforations extends through a thickness of the material from the first surface to the second surface, wherein the water enters into the plurality of perforations via capillary action; and applying a laser to the glass material at the cutting line to expand the water within the plurality of perforations to separate the material.

Dependencies are inferred from the claim text.