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US 2024/0173953 A1Published application
Method and apparatus for laminating a film on a substrate
AssigneeIntel Corporation
InventorsJoshua STACEY, Thomas HEATON, Dilan SENEVIRATNE
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Abstract
The present disclosure is directed to an apparatus including a first laminating component configured to laminate a dry film onto a substrate using heat, and a focused cure module configured to selectively cure a first portion of the dry film without curing a second portion of the dry film. The first portion forms a perimeter that surrounds the second portion.
Claims20
An apparatus comprising:
- a first laminating component configured to laminate a dry film onto a substrate using heat;
- and
- a focused cure module configured to selectively cure a first portion of the dry film without curing a second portion of the dry film, the first portion forming a perimeter that surrounds the second portion.
A method, comprising:
- laminating a dry film onto a substrate in a first lamination press using heat;
- and
- selectively curing a first portion of the dry film without curing a second portion of the dry film, the first portion forming a perimeter that surrounds the second portion.
Dependencies are inferred from the claim text.