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US 2024/0168352 A1Published application
Curved surface resin structure, electronic light control lens, and method for producing curved surface resin structure
AssigneeRicoh Company, Ltd.
InventorsTohru YASHIRO, Yukihiro Wakabayashi
Life of this patent
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Abstract
A curved surface resin structure includes a support, and a laminate section within a plane of the support, where at least a conductive layer and an electronic material layer are laminated in the laminate section. A surface curvature radius rA1 (mm) of end of the laminate section, a surface curvature radius rA2 (mm) of another end of the laminate section facing the one end with a center region of the laminate section present at a middle point, and an average curvature a radius rB (mm) of a surface of the laminate section satisfy Inequality (1): rA1, rA2<rB, or Inequality (2): rA1, rA2>rB.
Claims13
A curved surface resin structure, comprising:
- a support;
- and
- a laminate section within a plane of the support, at least a conductive layer and an electronic material laver being laminated in the laminate section,
- wherein a surface curvature radius rA1 (mm) of one end of the laminate section, a surface curvature radius rA2 (mm) of another end of the laminate section facing the one end with a center region of the laminate section present at a middle point, and an average curvature radius rB (MM) of a surface of the laminate section satisfy Inequality (1) below or Inequality (2) below;
- rA1,rA2<rB Inequality (1);
- rA,rA2>rB Inequality (2).
3 more elements
2:
- A cursed surface resin structure, comprising:
- a support;
- and
- a laminate section within a plane or the support, at least a conductive layer and an electronic material layer being laminated in the laminate section,
- wherein vertical surface displacement at a boundary between the laminate section and an end portion of the support where the laminate section is not formed is 0.8 micrometers or greater.
2 more elements
3:
- The curved surface resin structure according to claim 1, wherein the electronic material layer includes an electrolyte layer.
4:
- The cured surface resin structure according to claim 3, wherein the electrolyte layer is a solid electrolyte layer containing an ionic liquid or a polymer, or both.
5:
- The curved surface resin mature according to claim 3, wherein the electronic material layer contains an electrochromic material.
6:
- The curved surface resin structure according to claim 1, further comprising a foundation layer between the support and the conductive layer.
7:
- The curved surface resin structure according to claim 6, wherein the foundation layer contains an epoxy resin.
8:
- An electronic light control lens, comprising the curved surface resin structure according to claim 1.
9:
- A method for producing the curved surface resin structure according to claim 1, the method comprising:
- placing the support including the laminate section within the plane of the support, in which at least the conductive layer and the electronic material layer is laminated, in a molding die in a manner to contact the molding die;
- and
- performing insertion injection formation of injecting a resin onto an exposed side of the support to form a resin layer integrally with the support.
1 more element
10:
- The method according to claim 9, further comprising:
- before the performing insertion injection formation, compression-bonding the support including the laminate section within the plane of the support, in which at least the conductive layer and the electronic material laver is laminated, onto a curved surface molding die that is heated, to plastically deform the support and form the support having a curved surface shape.
11:
- The method according to claim 9, wherein in the performing insertion injection formation, a thickness of a shape of a resin injection port of the molding die is less than or equal to an average thickness of the curved surface resin structure, and a width of the shape of the resin injection port is greater than the thickness.
12:
- The method according to claim 9, wherein in the performing insertion injection formation, the resin is injected onto the exposed side of the support to form the resin layer integrally with the support under conditions that a temperature of the molding die is set to a temperature lower than a softening temperature of the resin by 10 degrees C. or more and a dwelling ensure is set to 100 MPa or higher but 150 MPa or lower.
13:
- The method according to claim 9, wherein the resin is a polycarbonate resin, and
- a temperature of the ceding die is 40 degrees C. or higher but 120 degrees C. or lower.
Dependencies are inferred from the claim text.