System and methods for chemical synthesis on wafers
AssigneeCentrillion Technologies, Inc.
InventorsBolan LI, Glenn MCGALL, Filip CRNOGORAC, Christopher Alan HACK, Wei ZHOU
Life of this patent
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Abstract
The present disclosure provides methods, device, and system for wafer processing. The wafer processing apparatus uses a nozzle in a lid to disperse a solution to the surface of a wafer. Further, the wafer is positioned on top of a vacuum chuck and does not spin while the solution is dispensed over the surface of the wafer via surface tension, thereby permitting the first solution to react with a reagent on the surface. Further, when dispensing the first solution, a separation gap between the lid and the wafer is at a predetermined distance, for example, from about 20 μm to about 2 mm.
Claims23
A wafer processing apparatus, comprising:
- (a) a lower portion;
- and
- (b) an upper portion, the upper portion comprising:
- a bowl affixed to the lower portion;
- a vacuum chuck disposed in the bowl, the vacuum chuck configured to rotatably hold a wafer;
- a movable cover disposed above the bowl and configured to engage with the bowl;
- a lid connected with the movable cover and disposed between the bowl and movable cover, the lid comprising a nozzle at the center of the lid;
- and
- three or more adjustment pins, wherein each member of the three or more adjustment pins inserted through an aperture in the movable cover, attached to the lid, and configured to adjust the position of the lid relative to the wafer;
- wherein the lid and the wafer define a reaction chamber between a bottom surface of the lid and a top surface of the wafer;
- and wherein the movable cover and the bowl are configured to enclose the vacuum chuck, the wafer, the lid, and the reaction chamber.
A method for processing wafers, comprising:
- (a) placing a wafer on top of a vacuum chuck of a wafer processing apparatus, the wafer processing apparatus further comprising:
- (i) a lower portion;
- and
- (ii) an upper portion, the upper portion comprising:
- a bowl affixed to the lower portion;
- a movable cover disposed above the bowl and engaged with the bowl;
- a lid connected with the movable cover and disposed between the bowl and movable cover, the lid comprising a nozzle at the center of the lid;
- and
- three or more adjustment pins, wherein each member of the three or more adjustment pins inserted through an aperture in the movable cover, attached to the lid;
- wherein the vacuum chuck is disposed in the bowl, the vacuum chuck configured to rotatably hold the wafer;
- (b) closing the movable cover, thereby enclosing the wafer in a closed space formed by the movable cover and the bowl;
- (c) adjusting any of the three or more adjustment pins, thereby making a bottom surface of the lid and the top surface of the wafer substantially parallel and forming a reaction chamber between the bottom surface of the lid and the top surface of the wafer, wherein the width of the reaction chamber ranges from 20 micrometer to 200 micrometer;
- and
- (d) dispensing at least one reagent into the reaction chamber by a nozzle;
- thereby substantially fill up the reaction chamber.
Dependencies are inferred from the claim text.