Mems resonator and mems resonator processing method

A micro electro mechanical system (MEMS) resonator, comprising:

• a substrate, a barrier layer, a conducting layer, a dielectric isolation layer, a harmonic oscillator, a first electrical isolation structure, and a first conducting structure, wherein:
• the substrate and the barrier layer are combined to form a cavity, a junction between the substrate and the barrier layer comprises the conducting layer, the dielectric isolation layer is comprised between the conducting layer and the barrier layer, and the dielectric isolation layer is configured to isolate electrical connection between the conducting layer and the barrier layer;
• the harmonic oscillator is connected to the conducting layer and is suspended in the cavity;
• the conducting layer is connected to the first conducting structure that is outside the barrier layer, and the first electrical isolation structure is comprised between the first conducting structure and the barrier layer;
• and
• the barrier layer and the dielectric isolation layer are configured to isolate the first electrical isolation structure from the cavity.

An electronic device, comprising a micro electro mechanical system (MEMS) resonator, wherein the MEMS resonator comprises:

• a substrate, a barrier layer, a conducting layer, a dielectric isolation layer, a harmonic oscillator, a first electrical isolation structure, and a first conducting structure, wherein:
• the substrate and the barrier layer are combined to form a cavity, a junction between the substrate and the barrier layer comprises the conducting layer, the dielectric isolation layer is comprised between the conducting layer and the barrier layer, and the dielectric isolation layer is configured to isolate electrical connection between the conducting layer and the barrier layer;
• the harmonic oscillator is connected to the conducting layer and is suspended in the cavity;
• the conducting layer is connected to the first conducting structure that is outside the barrier layer, and the first electrical isolation structure is comprised between the first conducting structure and the barrier layer;
• and
• the barrier layer and the dielectric isolation layer are configured to isolate the first electrical isolation structure from the cavity.