Systems for thermal management and methods thereof

A thermal management device, comprising:

• a shell comprising:
• a first conformal section and a second conformal section, wherein said first conformal section is parallel to said second conformal section, said first conformal section and said second conformal section are not in direct contact with one another, and wherein said first conformal section and said second conformal section are configured to receive a cooling fluid;
• and
• a fluid supply section configured to provide fluidic communication with both said first conformal section and said second conformal section, wherein said fluid supply section comprises:
• a first opening configured to allow said cooling fluid to flow into said shell;
• and
• a second opening configured to allow said cooling fluid to flow out of said shell;
• and
• an array of fins disposed within said first conformal section and said second conformal section, wherein said array of fins provides a path through which said cooling fluid can flow and wherein said array of fins is in thermal communication with said shell,
• wherein said array of fins comprises (i) a plurality of fins with one or more turbulating features disposed on a surface of one or more fins of said plurality of fins or (ii) a plurality of tapered fins.

A thermal management device, comprising:

• a first portion configured to operatively couple to at least a portion of an edge of an integrated circuit module (ICM);
• a second portion configured to facilitate a transfer of thermal energy from a surface of said ICM to a surface of said second portion, or vice versa, wherein said first portion and said second portion are not on a same plane;
• and
• at least one fluid flow path in thermal contact with said second portion and configured to facilitate a transfer of said thermal energy from said second portion to a cooling fluid disposed within said at least one fluid flow path,
• wherein said first portion is disposed substantially perpendicular to said second portion.