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US 2024/0153479 A1Published application
Acoustic matching layer material, acoustic matching sheet, composition for acoustic matching layer material, acoustic wave probe, acoustic wave measurement apparatus, and manufacturing method of acoustic wave probe
AssigneeFUJIFILM Corporation
InventorsKazushi FURUKAWA, Yoshihiro NAKAI
Life of this patent
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Abstract
Provided are an acoustic matching layer material containing an epoxy resin (A) component having an epoxy equivalent weight of 140 or less and metal particles (B) having a density of 10 g/cm3 or more at 20° C., in which a content of particles (C) having a density of less than 4.5 g/cm3 at 20° C. is less than 5% by mass; an acoustic matching sheet; a composition for an acoustic matching layer material; an acoustic wave probe; an acoustic wave measurement apparatus; and a manufacturing method of an acoustic wave probe.
Claims14
An acoustic matching layer material comprising:
- an epoxy resin (A) component having an epoxy equivalent weight of 140 or less;
- and
- metal particles (B) having a density of 10 g/cm3 or more at 20° C.,
- wherein a content of particles (C) having a density of less than 4.5 g/cm3 at 20° C. is less than 5% by mass.
1 more element
Dependencies are inferred from the claim text.