Cutting device and cutting method
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsRyuta ABE, Tatsuya MASADA, Masahide MARUYAMA
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Abstract
A cutting device a device for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate, a first active material layer, and a second active material layer, the cutting device including: a first process unit that causes a first cutting blade to form an incision in the first active material layer; and a second process unit that causes a second cutting blade to cut the continuous body.
Claims6
A cutting device for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate having a first surface and a second surface facing away from each other, a first active material layer laminated on the first surface, and a second active material layer laminated on the second surface, the cutting device comprising:
- a first process unit that causes a first cutting blade to advance from a side of the first active material layer to a position short of the current collector plate to form an incision in the first active material layer;
- and
- a second process unit that causes a second cutting blade to advance from a position on a side of the second active material layer that faces the incision to a position beyond the current collector plate to cut the continuous body.
A cutting method for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate having a first surface and a second surface facing away from each other, a first active material layer laminated on the first surface, and a second active material layer laminated on the second surface, the cutting method comprising:
- causing a first cutting blade to advance from a side of the first active material layer to a position short of the current collector plate to form an incision in the first active material layer;
- and
- causing a second cutting blade to advance from a position on a side of the second active material layer that faces the incision to a position beyond the current collector plate to cut the continuous body.
Dependencies are inferred from the claim text.