Back to results
US 2024/0124747 A1Published application
Thermal bonding film, method for producing same, and water tank adhesion structure using same for air-to-water source heat pump
AssigneeLG Electronics Inc.
InventorSanghyun HONG
Life of this patent
Estimating the term…
Abstract
Disclosed is a water tank adhesion structure using thermal bonding film for air-to-water source heat pump, the thermal film, which is activated by the temperature of the hot water and is inserted between a hot water tank and insulation material for tight adhesion therebetween, activating when hot water is supplied, which is when insulation is actually necessary.
Claims20
A thermal bonding film comprising:
- 70 to 95% by weight of a copolymer including at least two types of polymeric monomers;
- 1 to 5% by weight of a dispersant;
- 0.1 to 3% by weight of a coagulant;
- and
- 0.1 to 3% by weight of an initiator.
2 more elements
Dependencies are inferred from the claim text.