Method for preparing the residue of a donor substrate, a layer of which has been removed by delamination
OwnerIsabelle Huyet, Luciana Capelloinventors
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Abstract
A method is used for preparing the residue of a donor substrate, the residue comprising, on a peripheral zone of a main face, a peripheral ring. The method comprises: a first step of removing at least part of the peripheral ring; a second step of processing the main face of the residue aiming to remove a surface layer; a third step, after the second step, of grinding the peripheral zone of the main face of the residue, the third grinding step aiming to reduce the elevation of the peripheral zone.
Claims20
A method for preparing a residue of a donor substrate, with a thin layer having been removed from the donor substrate by delamination at a fragile plane formed by an introduction of light species, the residue comprising, on a peripheral zone of a main face, a peripheral ring corresponding to an unremoved part of the donor substrate, the method comprising:
- a first step of removing at least part of the peripheral ring;
- a second step of processing the main face of the residue to remove a surface layer;
- and
- a third step, after the second step, of ion etching grinding the peripheral zone of the main face of the residue, the third reducing an elevation of the peripheral zone.
Dependencies are inferred from the claim text.