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US 2024/0118609 A1Published application
Resin composition for solder resist, solder resist film, and circuit board
AssigneeSekisui Kasei Co., Ltd.
InventorKoichiro OKAMOTO
Life of this patent
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Abstract
There are provided a resin composition for a solder resist, a solder resist film, and a circuit board that exhibit an excellent low dielectric property by a non-conventional new approach. A resin composition for a solder resist according to an embodiment of the present invention contains a thermosetting resin, an inorganic filler, and hollow resin particles, in which the hollow resin particles are contained in the resin composition for a solder resist in an amount of 1% by weight to 50% by weight.
Claims3
A resin composition for a solder resist comprising a thermosetting resin, an inorganic filler, and hollow resin particles,
- wherein the hollow resin particles are contained in the resin composition for a solder resist in an amount of 1% by weight to 50% by weight with respect to the total solid content of the resin composition for a solder resist.
Dependencies are inferred from the claim text.