Method of manufacturing multilayer electronic component

A method of manufacturing a multilayer electronic component, the method comprising:

• cutting a stack, in which a plurality of internal electrode patterns and a plurality of ceramic green sheets are alternately stacked in a stacking direction, in the stacking direction to obtain a plurality of unit chips;
• and
• attaching a portion of a ceramic green sheet for a side margin portion to the plurality of unit chips in a direction, different from the stacking direction,
• wherein the attaching includes attaching the portion of the ceramic green sheet for a side margin portion to the plurality of unit chips by compression between a first elastic body on which the ceramic green sheet for a side margin portion is disposed and the plurality of unit chips,
• the first elastic body includes a first elastic layer having a first elastic modulus and a second elastic layer having a second elastic modulus, different from the first elastic modulus, and disposed between the plurality of unit chips and the first elastic layer,
• the attaching further includes rotating the plurality of unit chips disposed on a second elastic body before the ceramic green sheet for a side margin portion is disposed on the first elastic body, and
• the second elastic body includes a third elastic layer having a third elastic modulus and a fourth elastic layer having a fourth elastic modulus, different from the third elastic modulus, and disposed between the plurality of unit chips and the third elastic layer.

A method of manufacturing a multilayer electronic component, the method comprising:

• cutting a stack, in which a plurality of internal electrode patterns and a plurality of ceramic green sheets are alternately stacked in a stacking direction, in the stacking direction to obtain a plurality of unit chips;
• and
• attaching a portion of a ceramic green sheet for a side margin portion to the plurality of unit chips in a direction, different from the stacking direction,
• wherein the attaching includes attaching the portion of the ceramic green sheet for a side margin portion to the plurality of unit chips by compression between a first elastic body on which the ceramic green sheet for a side margin portion is disposed and the plurality of unit chips,
• the first elastic body includes a first elastic layer having a first elastic modulus and a second elastic layer having a second elastic modulus, different from the first elastic modulus, and disposed between the plurality of unit chips and the first elastic layer,
• the attaching includes attaching the portion of the ceramic green sheet for a side margin portion to the plurality of unit chips by compression between the first elastic body and a second elastic body, after the plurality of unit chips are disposed between the first elastic body and the second elastic body, and
• the second elastic body includes a third elastic layer having a third elastic modulus and a fourth elastic layer having a fourth elastic modulus, different from the third elastic modulus, and disposed between the plurality of unit chips and the third elastic layer.