Directly coupled optical interposer

A system comprising:

• an optical interposer comprising:
• a substrate comprising a first surface;
• a second surface opposite the first surface;
• and a hole extending from the first surface to the second surface, the hole comprising a first sidewall;
• a first optical interconnect between the first surface and the second surface, and comprising a first end at the first sidewall;
• and
• a photonic integrated circuit (PIC) within the hole, the PIC comprising a second sidewall;
• and a first optical port at the second sidewall;
• wherein the second sidewall is proximate to the first sidewall, and the first end of the first optical interconnect is proximate to and aligned with the first optical port;
• a logic integrated circuit (IC) device;
• and
• a memory IC device.

A method comprising:

• determining location data by measuring a location of a first device relative to a location of a substrate, wherein:
• the substrate comprises a first surface;
• a second surface opposite the first surface;
• and a hole extending from the first surface to the second surface, the hole comprising a first sidewall;
• and
• the device is within the hole and comprises a second sidewall;
• and an optical port at the second sidewall, wherein the second sidewall is proximate to the first sidewall;
• providing the location data to a laser tool;
• writing an optical waveguide in the substrate by the laser tool using the location data, wherein the optical waveguide is between the first surface and the second surface, and comprises a first end at the first sidewall;
• and the first end is proximate to and aligned with the optical port.