Impingement cooling providing enhanced localized cooling of a heatsink

A heatsink having enhanced localized cooling, said heatsink comprising:

• a first wall;
• a second wall;
• a heatframe;
• a coolant channel between the first wall and the heatframe, wherein a bulk coolant flows through the coolant channel;
• and
• one or more nozzles that extend into the coolant channel, wherein a high-pressure manifold is formed between the first wall and the second wall, the high-pressure manifold having an inlet and a seal such that a high-pressure coolant flows into the high-pressure manifold and is forced out the one or more nozzles to impinge onto the heatframe and mix with the bulk coolant in the coolant channel to form a mixing area and an enhanced cooling area of the heatframe to provide enhanced localized cooling to at least a portion of a heat producing device that is proximate to or in partial contact with the heatframe proximate to the enhanced cooling area of the heatframe.