Insulation film-provided flat conductive plate and method for manufacturing same
AssigneeMitsubishi Materials Corporation
InventorsKazuhiko Yamasaki, Nagisa Sako
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Abstract
This flat conductive plate provided with an insulating film includes a flat conductive plate which is a punched product, and an insulating film which coats at least a part of the flat conductive plate, the insulating film is an electrodeposited film, the insulating film includes a polyamide-imide resin and a fluorine-based resin, an amount of the fluorine-based resin with respect to a total amount of the polyamide-imide resin and the fluorine-based resin is in a range of 72% by mass or more and 95% by mass or less, a relative permittivity at 25° C. is in a range of 2.2 or more and 2.8 or less, and an average film thickness is in a range of 5 μm or more and 100 μm or less.
Claims9
A flat conductive plate provided with an insulating film comprising:
- a flat conductive plate which is a punched product;
- and
- an insulating film which coats at least a part of the flat conductive plate,
- wherein the insulating film is an electrodeposited film,
- the insulating film includes a polyamide-imide resin and a fluorine-based resin,
- an amount of the fluorine-based resin with respect to a total amount of the polyamide-imide resin and the fluorine-based resin is in a range of 72% by mass or more and 95% by mass or less,
- a relative permittivity at 25° C. is in a range of 2.2 or more and 2.8 or less, and
- an average film thickness is in a range of 5 μm or more and 100 μm or less.
A method for manufacturing a flat conductive plate provided with an insulating film, the method comprising:
- an electrodeposition step of electrodepositing an electrodeposition dispersion on a surface of a flat conductor which is a punched product to obtain a flat conductor provided with an electrodeposited layer, wherein the electrodeposition dispersion contains polyamide-imide resin particles and fluorine-based resin particles, and an amount of the fluorine-based resin particles with respect to a total amount of the polyamide-imide resin particles and the fluorine-based resin particles is in a range of 72% by mass or more and 95% by mass or less;
- and
- a baking step of heating the flat conductor provided with an electrodeposited layer at a temperature of 260° C. or higher and 350° C. or lower to bake the electrodeposited layer on the flat conductor.
Dependencies are inferred from the claim text.